- Exceptional Hardness
Diamond wheels are incredibly hard and wear-resistant, making them ideal for grinding other hard materials such as carbide. This feature also allows diamond wheels to withstand high material removal rates and provide better longevity when compared to conventional abrasive wheels.
- Superior Grinding Performance
From rough grinding at high feed rates to cutting brittle materials with high
accuracy, the composition of a diamond grinding wheel can be manipulated to serve a multitude of applications.
This diversity stems from the combination of grit size and the concentration (or volume) of diamond grit present in the wheel’s bond. If finer grit is used, a higher quantity of grit particles can be included in the wheel bond. If larger grit is used, not as many grit particles will be able to fit into the wheel bond.
Fine grit is useful for high precision and works well with brittle materials, while coarse grit is ideal for faster material removal.
- Low Heat Generation
The bond structure of a diamond abrasive wheel does impact its heat-resistant
abilities. Resin bonds, for example, generate the least heat overall during grinding and are typically used for softer materials like ceramics and composites. Known as a more “flexible” bond, resin bonds have a faster-paced grit renewal rate than metal or vitrified bonds. This allows for a consistent, sharp cutting surface.
Slightly less heat efficient, metal bonds are typically used for grinding tougher
materials and are much harder than resin bonds. By retaining grit particles for longer, this bond allows the form of the wheel to hold its shape for extended periods.
Vitrified bonds are made of ceramic material, ideal for heat dissipation. They are typically suggested for grinding materials with low thermal conductivity.
Regardless of the bond structure, using a diamond grinding wheel reduces the
risk of heat damage to both the wheel and the workpiece. Synthetic diamond abrasive is highly conductive and chemically inert. This makes it a great material for heat dissipation.