Although they are composed of the same basic structure, a base bonded to a suspension of abrasive, cutoff wheels, and grinding wheels serve very different purposes. Instead of slowly removing material from the surface of a workpiece like a grinding wheel would, cutoff wheels are designed to slice through the material. Typically ranging from 0.015” to 1/16” in width, they are much thinner than most wheels.
Diamond cutoff wheels are available in a multitude of bond options but specifically contain diamond abrasive. These wheels are utilized in a variety of industries including wood and metal tooling production, iridium and platinum cutting for manufacturing spark plugs, slicing silicon wafers for computer chips, glass, ceramic, and magnet cutting for automotive and aerospace tools/parts. Being so commonly seen throughout manufacturing, I decided to compile the three main tips for using a diamond cutoff wheel- straight from the experts.